Relationship between grain boundary segregation and grain boundary diffusion in Cu-Ag alloys
نویسندگان
چکیده
منابع مشابه
Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys
Article history: Received 10 February 2016 Received in revised form 22 May 2016 Accepted 8 June 2016 Available online xxxx The relationships betweenmicrostructure, controlled by alloying elements prone to grain boundary segregation, and electrical resistivity in sputtered nanocrystalline Cu were investigated. We find a non-monotonic dependence of themean grain size on solute concentration for b...
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ژورنال
عنوان ژورنال: Physical Review Materials
سال: 2020
ISSN: 2475-9953
DOI: 10.1103/physrevmaterials.4.073403